二手 TEL / TOKYO ELECTRON ACT 12 #9313699 待售

System, 12" Wafer type: Notch Right to left Loading configuration: (4) Loaders Cassette type: FOUP Main controller missing Main system: Mainframe with system controller (4) Cassettes (25) Slots Coater unit (2-1, 2-2 Modules): (4) Dispense nozzles with temperature controlled lines RDS Pump PR Suck-back valve: (8) Auto suck-back valves Rinse nozzle: Back / EBR / Solvent bath for etch unit Rinse system: 3-Liters (2) buffer tank systems Thinner supply: CCSS Programmable side rinse: (4) PR Nozzles (8) Bottles: (2) Bottles / (2) Nozzles BCT Unit (2-3,2-4 Modules): (4) Dispense nozzles with temperature controlled line RDS Pump PR Suck-back valve: (8) Auto suck-back valves Rinse nozzle: Back / EBR / Solvent bath for each unit Rinse system: 3-Liters (2) buffer tank systems Thinner supply: CCSS Canister tank Developer unit (3-1, 3-2, 3-3, 3-4 Modules): NLD Nozzle / Unit (2) System nozzles for DI rinse 2-Points for back side rinse Developer system: 3-Liter (2) buffer tank systems Developer supply: CCSS Developer temperature control system ASML I/F Wafer stage (2) Adhesion units (ADH): Sealing closed chamber with Built-in hot plate HMDS Tank with float sensor HMDS Supply: Local bottle (4) Low temperature Hot Plates (LHP) (3) High temperature Hot Plates (HHP) (9) Chill plates (TCP) (12) Precision Hot Plates (PHP) (2) TRS Units (2) Wafer Edge Exposure (WEE) Units (2) Temperature Control Units (TCU) OEM Type Temperature control units (TCU) MFC controller Chemical cabinets: Cabinet 1: HNDS And solvent cabinet Cabinet 2: DEV Solution chemical cabinet Missing parts: Main controller T and H Controller AC Power supply: 200/220 VAC, 668 A (Full-load Ampere) 2004 vintage.