二手 ASML Twinscan XT 1250D #9228718 待售

ArF Scanner, 12" Track pre-warning signal: APR Input / Output conflicts: Avoid track Type of wafer table on chuck 1 and 2: Zerodur Wafer stage: Type 2 Wafer carrier: Right (25) Wafers per carriers Wafer stage types: Dual chuck Lower docking plates WS Balance mass: Stainless steel WH Robot power amplifier: CPM 20 Wafer stage fast stiff X move electronics Wafer stage mirror block down electronics Interferometer axis version at exposure: 3 Plus, 1 Axis Wafer handling pneumatic Chuck 1 and 2, 12" Docking wheels at WH unload Docking plate height: Low Carrier handler type: Mark I 300 FOUP Wafer handling load: Double fold arms Unload robot type: Z Stroke, 12 mm Wafer handler WRT BF shifted in Z Encoders measurement system: Hall sensors for zeroing Reticle stage chuck type: Glued leaf spring Type 2: Glued LS, Pneumatic GC, IFM / ENC Reticle carrier: Right Integrated reticle inspection system: PPD1 With IRIS1 Integrated reticle library: IRL Reticle, 6" Reticle carrier tag reader Reticle stage long stroke motor type: Cobalt ferro 18 teeth No closing disk No enhancements in reticle monitor Reticle stage long stroke config: Type 3 CoFe-18 Motor SB Controller Vacuum supply Pneum GC Reticle stage: Lens cooler box with anti-aliasing filter Maximum reticle ID length: 24 Characters Reticle stage measurement system on scan: HEIDENHAIN Encoder RS Object field Reticle exchange type: Retex E option Reticle handler Dynamic performance calculation: Mark 1 Stages sample rate: 5.0 kHz Interferometer electronics Capacitive Z-height sensor type: Dual Z sensor board IFM Config at measure side: 8-Axes Dose system: Test sequence 1 Depolarizer type: Fixed Pupil qualification method: Center of gravity method Unpolarized illumination amorph DOE Validity range: Exact matching for UIP data Active element: ALE BMU Reading: DOE1 Plane Lens type: 12 Light-source architecture: Laser Light-source wave-length: 193 nm Dose mapper REMA Architecture: REMA C Illuminator type: 120 AXICON Zoom architecture: ZZA / 120 Automated DOE exchanger / Architecture: 5 Slots MIP control UNICOM / Architecture: Motor Imaging electronics architecture: B Architecture Attenuator type Test table Z-axis: Worm wheel PUPICOM / Architecture: DC Motor with gearbox (5) Z Lens manipulators Active lens element Active element (4) Semi-active X-Y lens manipulators Setup sensor board Imaging generic power amplifier Imaging control rack configuration Projection multiplexer board LEC Rack in electronic architecture Projection GPA configuration (5) Lens NEXZ Manipulators Spot sensor surface coating: Bilatal Energy sensor: VLOC Spot sensor chuck 1 and 2: VLOC Uniformity improvement package Pupil measurements with ILIAS Beam control: Beam adjustment Extended spot sensor match (5) Rxms / (5) Ryms Exchangeable last lens element UV Shutter Dose control hardware: ISB Illuminator platform: Aerial 2 Test table architecture: Aerial 2 Illumination mode DUV Light source power level: 45 Watt Lens top tool connection Scanning energy sensor calibration Position of spot sensor on chuck 1 and 2: Layout 1 Z-Capture for low reflectivity wafer Circuit dependent FEC Focus monitoring LS Focus node 3 Level sensor processing rack (LCSR) LS PEMM Config LS CPU Config: (3) CPUs Recipe creator: Light Report data category: Enhanced diagnostic CDC Proximity matching MBDS Control Enhanced exposure 1 XML report content level: Basic Mark type: ASML Mark Alignment laser configuration: (2) Color laser Boards: ODB With ADB Athena narrow marks Twinscan Alignment sensor types: Athena narrow marks OM Athena focus improvement 1 Maximum alignment speed: Setting 2 AACR Processing rack Purging configuration 3 LCW Circuit set-ups Clean air configuration CT Miscellaneous rack Clean air temperature controls: Driver and ACC Purge hoods configuration: Compressed clean air and extremely clean dry air Metro frame type: Type 1 Inlet restriction for clean air: Inlet restriction at right side Reticle stage purged mini environment Gas control unit type: High Flow (HF) Lens circuit water flow: High Motor circuit water flows IFM Laser configuration: AOM Re-combo laser Position control rack configuration: Rack configuration type 3 Position control power rack configuration type 3: Stages power rack upto E-spec (5) Motion controllers Position and motion control rack Reticle stage short stroke X/Y11/Y12/Y21/Y22/Y11/Y11 amp: PADC 100 V / 16 A Wafer stage short stroke 1 and 2 XY1/ XY2/XY3 amp: PADC 100 V / 16 A Reticle stage short stroke Z1/Z2/Z3 amp: Pass low current 8.5 A Wafer stage short stroke 1 and 2 Z1/Z2/Z3 amp: Pass low current 8.5 A Reticle stage long stroke Y11/Y12/Y21/Y22 amp: 450 V, 20 A PAAC Reticle balance mass 1/2 amp: 450 V, 20 A PAAC AT-pepD Wafer stage long stroke E/M X amp: 400 V, 16 A PAAC AT-D Wafer stage long stroke E and M Y1/Y2/CS amp: 400 V, 16 A PAAC AT-D Wafer stage balance mass 11/12/21/22 amp: 325 V, 14 A PAAC AT-C Pressure update rate: 2 Hz / 4 Hz PEP Image streaming Overhead reductions: LOR2 SMASH Reuse capture information in stage alignment Wafer plane deviation check with focus monitoring Wafer reject mode Lens heating history in LH feed forwards 2D Grid correction Ast offset correction in TIS LHFB/LOCO (Version 3) NEXZ-Tilt per exposure Projection lens: No off-axis slit Enhanced throughput reticle alignment Adjustable wavelength Alignment report encryption Stage alignment filter Lot correction sequence: Type B Lens heating feedback and calibration Layout version number: TIS Plate 1 and 2 on chuck 1/2 Wavelength / Energy sensor AM Controller hardware: SUCR Lens heating No polarization shaping element retractor hardware No air gauge device No leveling throughput improvement on measure side Litho guide: SAMOS Stray light test PUPIL Measurement FOCAL Measurement Leveling verification test ILIAS Sensor: Chuck 2 ILIAS Sensor type chuck 2: Multiple scan grid SASO Robustness and fiber connectivity Patch strategy: Patch level Chuck ZERO Fiducial: ILIAS MK2 XT Machine architecture XT Architecture revision: Rev 1 No exchangeable pupil lens element No sigma calibration No sigma WIP preserving offset CDC Wafer handler productivity: Level 0 Does not include Hard Disk Drive (HDD) 2004 vintage.