二手 ASML XT 760F #9305673 待售
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ID: 9305673
晶圓大小: 12"
優質的: 2006
DUV Scanner, 12"
External interface module
Bottom module
Reticle stage
Covering panels frame parts
Covering panels frame MCAB
Covering panels
RSRC Cabinet
MCWC Cabinet
MDC Cabinet
LCWC Cabinet
Exhaust cabinet
Machine parts clean folder
Side channel blower
(6) Machine parts
Double stage
Hard Disk Drive (HDD), 4.1.0
Locking kit
TAMIS (EMTA):
Z7 Offset: ±4.0 nm (-5.96)
Z8 Offset: ±4.0 nm (-1.11)
Z7 Tilt in X: ±2.0 nm/cm (-0.04)
Z9 Offset: ±4.0 nm (0.48)
SAMOS (EMCA):
SAMOS: ≤3% (1.74)
SLIT Uniformity (LUSU):
- / NA / S.In / S.Out / Control spec / Down spec / Result
Annular (M-Action) / 0.7 / 0.55 / 0.85 / 1.50% / 3.00% / 0.31
Conventional / 0.65 / 0 / 0.75 / 1.50% / 3.00% / 0.26
Conventional / 0.7 / 0 / 0.6 / 1.50% / 3.00% / 0.28
Model result parameter:
Best focus: ±0.015 (0.002)
Image height C1 (um): 0 ±0.015 (0.002)
Image height C2 (um): 0 ±0.015
Image height different (um): 0 ±0.015
Image tilt ry C1 (urad): 0 ±0.5 (-0.279)
Image tilt ry C2 (urad): 0 ±0.5
Image tiltry different (urad): 0 ±0.5
Intrafield:
Focus range chuck 1 Before: <120 nm (91.6)
Focus range chuck 2 Before: <120 nm
Focus range chuck 1 After: <120 nm (89)
Focus range chuck 2 After: <120 nm
Focus range C1 different (nm): 0 +15 (2.6)
Focus range C2 different (nm): 0 +15
Astigmatism range C1 different (nm): 0 ±5 (0.6)
Astigmatism range C2 different (nm): 0 ±5
Result after correction:
IPD Mean (nm): <120 (89)
IPD STDEV (nm): <10
Astigmatism mean (nm): <70 (36)
Astigmatism STDEV (nm): <10
Dose accuracy and repeatability performance (ODAR):
Dose accuracy: <2.0 (max) (1.416)
Dose repeatability: <0.5 (0.057)
CYMER Laser not included
2006 vintage.
ASML XT 760F是下一代先進晶圓步進器，旨在作為生產先進半導體器件的市場領先解決方案。ASML XT:760F是一種晶圓步進器，支持深紫外光刻（DUV）和準分子激光光刻（EUV）等技術。為進一步優化半導體生產工藝提供了卓越的精度和高通量速率。XT 760 F提供了許多先進的功能,使其與傳統的晶圓步進器區分開來。它采用高速雙軸亞微米級設備，提供最高精度和穩定性。雙軸系統利用位置編碼器和位置感應伺服電機，以及自適應前饋/反饋控制算法，提供晶片在步進器中極精確的定位。此外,ASML XT 760 F提供了一個高度可靠的像差校正單元,可確保即使在尼康投影光學器件最陡峭的範圍內也能在整個晶圓區域保持圖像質量。XT 760F還具有模塊化設計,允許靈活和易於調節的機器.模塊化設計消除了任何可能導致晶片作用或對準發生不可接受變化的因素,從而為晶片步進器的光學提供了最大程度的保護。XT:760F先進的控制工具還可以集成蝕刻和拋光等附加工藝。ASML XT 760F按照ISO/EEE 9000標準提供無懈可擊的晶片處理,包括整個晶片表面的均勻曝光。過程參數統一且可重復,即使在多次曝光之後也是如此。此外,ASML XT:760F能夠以極高的吞吐量速度運行,並具有較低的殘余晶圓性能。XT 760 F通過實現晶圓處理的卓越可重復性，確保了先進的半導體器件生產過程以盡可能高的精度進行。綜上所述,ASML XT 760 F是一款先進的晶片步進器,具有卓越的精度、高吞吐量、卓越的圖像質量和高重復性,是生產先進半導體器件的市場領先解決方案。
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