二手 CANON FPA 2500 i3 #293819904 待售

製造商
CANON
模型
FPA 2500 i3
ID: 293819904
晶圓大小: 8"
優質的: 1996
Stepper, 8" Exposure Performance: Normal illumination: 0.40 µm or better SIA illumination: 0.35 µm or better SIB illumination: 0.40 µm or better PFI‑26, 1.025 µmt CD Depth of focus: Normal illumination: ≥ 1.0 µm (range) SIA illumination: ≥ 1.2 µm (range) SIB illumination: ≥ 1.4 µm (range) 0.40 µm L&S Image surface width (Normal illumination): ≤ 50 µm Distortion: Normal illumination: within ±0.07 µm SIA illumination: within ±0.08 µm SIB illumination: within ±0.08 µm Illuminator: Illumination Intensity: Normal illumination: ≥ 550 mW/cm² SIA illumination: ≥ 330 mW/cm² SIB illumination: ≥ 330 mW/cm² Illumination Uniformity: Normal illumination: Within ±1.2% SIA illumination: Within ±1.5% SIB illumination: Within ±1.5% Dose Control Accuracy ≤ ±1.2% Masking Accuracy ≤ ±100 µm Alignment Accuracy: Reticle Rotation Accuracy: ≤ ±0.02 µm Reticle Rotation Repeatability: ≤ ±0.03 µm (range) Alignment Accuracy: HeNe TV AGA: ≤ ±0.07 µm (| m | + 3s) Broad Band TV AGA: ≤ ±0.07 µm ( m | + 3s) Auto Focus: Repeatability: ≤ 0.12 µm (3s) Die By Die Leveling: Repeatability: ≤ 10 µm (3s) Compensation Range: ≤ ±100 ppm XY Stage Accuracy Stepping Accuracy: ≤ 0.06 µm (3s) Scaling: ≤ ±1.0 ppm Orthogonality: ≤ ±1.0 ppm Prealignment Accuracy: Mechanical PA Accuracy: ≤ ±40 µm Throughput: L‑Type Auto Feeder With Die‑by‑Die Leveling OFF: 6" (45 shots): 62 wafers/hour or more 8" (78 shots): 44 wafers/hour or more With Die‑by‑Die Leveling ON: 6" (45 shots): 57 wafers/hour or more 8" (78 shots): 40 wafers/hour or more R‑Type Auto Feeder With Die‑by‑Die Leveling OFF 6" (45 shots): 61 wafers/hour or more 8" (78 shots): 44 wafers/hour or more With Die‑by‑Die Leveling ON: 6" (45 shots): 56 wafers/hour or more 8" (78 shots): 40 wafers/hour or more Reliability: Reticle handling: 50 cycles Wafer handling: 300 cycles Compact chamber: Temperature Control: Booth: 21 °C Stage: 23 °C Cleanliness: within ±0.1 °C 1996 vintage.
CANON FPA 2500 i3是晶圓步進器-一種用於半導體工業的晶圓製造和檢驗工具。適合對寬範圍的晶片進行鑒定檢查,直徑從300毫米到200毫米不等。i3是雙場對準系統,有兩個截然不同的操作區域。專用對準級使得晶片和基板能夠精確對準,這要歸功於它具有亞微米精度的高精度電動機。然後將晶片置於焦平面陣列中,這是一系列光學元件,可捕獲晶片表面的高分辨率圖像,然後將其投影到液晶顯示器上,以便於查看。CANON FPA-2500I3包括各種旨在提高效率和可靠性的功能。它具有高速橫向運動系統,用於晶圓的快速飛行運動,以及用於溫度控制和提高吞吐量的全封閉光學組件。它還包括用於檢測和放置缺陷的專有模式匹配算法。i3提供先進的晶圓映射功能,包括物理、電氣和光學映射,用於高效晶圓鑒定和檢查。它允許對諸如劃痕和汙漬等顆粒進行高清視頻檢查,從而能夠更準確地檢測缺陷並拒絕損壞的晶片。最後,系統具有較大的內存容量,支持高達1 TB的內部內存,用於存儲圖像和數據以進行分析,並生成PDF、PSD和CSV格式的報告。為方便用戶,FPA-2500 I3具有用戶友好的界面,允許快速輕松瀏覽復雜的用戶控件。此外,它還具有多種掃描參數,包括掃描速度、圖像類型和圖像分辨率,以及用於收集關鍵數據以進行質量控制的各種傳感器。i3還支持通過互聯網更新軟件,使用戶能夠及時了解晶圓檢測技術的最新進展。總體而言,FPA 2500 i3是一種高效可靠的晶圓步進器,用於半導體制造和檢驗過程。i3具有高精度電機、強大的光學組件以及廣泛的軟件和硬件功能,非常適合以最高效的方式生產和鑒定高質量晶片。
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