二手 ULTRATECH Saturn Spectrum 300 #9198660 待售
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已售出
ID: 9198660
優質的: 2005
Stepper
Mainframe configurations:
Controller unit:
Centralized control and distributed control
SECS Compatibility
Exposure unit:
Hg Lamp
GHI-Line light source
Indexer unit:
Two cassette loader / Unloader
Universal wafer size
Transfer unit:
Robot
Can handle 6", 8" and 12" wafers, both notch and flat type
Wafer stage unit:
Linear motor XY stage
Reticle stage
Automated wafer thickness compensator
Alignment unit:
Pre-alignment: Automatic enhanced global alignment
Through the lens alignment
MVS (Machine vision system) pattern recognition system
Closed loop dose control system
Focus detector and focus leveling system
Operation unit:
Alignment monitor
Program execution monitor
Keyboard or joy-stick
Printer
Safety unit:
Vibration isolation system
Auto alarm system
Interlock protection system
Hardware specification:
Notch and flat wafer
SEMI and JEIDA standard
Wafer thickness: 11-30 mil
Stage type:
Linear motor drive
3-Axes of freedom
Wafer handling:
Cassette to cassette
Conform to SEMI and JEDIA standard
Hg Lamp type: 1000 Watt
Reticle size: 6 x 6 x 0.25 inch
Reticle library: (12) Slots library with barcode reader
Fields per reticle:
1-4
6 x 6" -2- field, max field size: 44.0 x 26 mm
6 x 6" -3- field, max field size: 37.6 x 26 mm
6 x 6" -4- field, max field size: 27.6 x 26 mm
Maximum field size: 44 x 22 mm
Global alignment: Within ± 40 µm placement accuracy
Enhanced global alignment: 500 nm, 3δ (Reticle image recognition alignment system)
Alignment optical system: Bright field alignment
Up-time: ≥90%
MTTR: <4 Hours
Reliability test: Cycling test: > 500 wafers (with alignment) processed without reject and fail
Wafer breakage: ≤ 1/ 10000
Vibration control: Active air isolation
Computer / Printer type:
VME Bus controller
CPU: ≥35 MHz
Color graphic monitor
Enclosed impact printer
Process specification:
Minimum feature size: ≤1.40µm
DOF (Depth of focus):
≥ 4 µm (at 2 µm L/S with 2 µm thickness of resist)
≥ 8 µm (at 30/10 µm L/S with 23 µm thickness of resist)
≥10 µm (at 50 µm L/S with 120 µm thickness of drvr film)
Dynamic focus: Provides capability of exposing photosensitive films from 1- 125µm
CD Uniformity: ≤±10%
Irradiance at wafer plane: ≥1200mW/Cm²
Maximum image area: 44 X 26 mm²
Exposure spectrum: 350 - 450nm (GHI-line/ Full spectrum)
Exposure uniformity: ≤ ±4%
Alignment accuracy: ≤ 0.5 µm (3δ)
Throughput: 8-inch wafer, 400mj/ Cm², 44 x 22 mm field size, wafer layout 26 steps: >60 wph
Exposure linearity:≤ ±1%
2005 vintage.
ULTRATECH Saturn Spectrum 300是一種高性能晶圓步進器,旨在支持光刻應用的所有成像要求。憑借其最先進的設計,Saturn Spectrum 300晶圓步進器在整個晶圓上提供精確的對準、可重現的曝光和可重復的成像。步進器具有先進的光學設備,具有寬視場(FOV),可確保晶圓表面的最大分辨率。FOV可以延伸到300毫米,達到的總聚焦深度(DOF)小於2.5微米。系統中使用的數字化高速CCD攝像頭和復雜的模式識別算法確保了高精度對準和精確曝光。ULTRATECH Saturn Spectrum 300的可調基板提供精細的運動分辨率和晶圓的精確對準。基板最多可調整四個區域的截面登記,允許暴露於不規則系統。步進器的運動輪廓可以調整,以優化吞吐量,減少循環時間。Saturn Spectrum 300具有一系列高級成像工具,包括復雜的掩模模式識別功能、負圖像條變換工具和高級自動對焦單元。高級掩碼模式識別功能在印記過程中識別並定位對象。負圖像條變換工具支持在印跡過程中陣列方向的變化。先進的自動對焦機確保在成像時進行適當的對焦調整。此外,ULTRATECH Saturn Spectrum 300設有3軸機動級,提供九個自由度,以提供卓越的運動精度。3軸電動級利用各種步驟支持給定結構內的模式匹配,而兩次曝光之間的集成旋轉式快門產生極為均勻的曝光場。這種晶圓步進器與推薦的輻射源如ArF激光器和I-line兼容,用於精確印跡。Saturn Spectrum 300 wafer stepper內置了輻射劑量測量的安全功能,以保護用戶免受暴露。總體而言,ULTRATECH Saturn Spectrum 300是一種用途廣泛且精確的晶圓步進器,在光刻應用中提供卓越的分辨率、重復性和準確性
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