用 CINCINNATI 2 (WAFER GRINDING, LAPPING & POLISHING) 待售的

用 CINCINNATI 2 待售的
製造商:CINCINNATI 模型:2 類別:WAFER GRINDING, LAPPING & POLISHING
CAE has broad access to semiconductor related equipment direct from fabs, often unavailable through other sources. CAE finds the best deals on used CINCINNATI 2. CAE has 2 wafer grinding, lapping & polishing currently available. We’re accountable for every transaction — CAE will seek to collect as much information as you require to ensure that you receive the equipment in the condition that you are expecting. Send us your request to buy a used wafer grinding, lapping & polishing CINCINNATI 2 and we will contact you with matches available for sale.
loading

2 結果發現: 用 WAFER GRINDING, LAPPING & POLISHING, CINCINNATI 2

  • Photo CINCINNATI 2

    CINCINNATI: 2 #134544

    WAFER GRINDING, LAPPING & POLISHING Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Length between workhead and c...
  • Photo CINCINNATI 2

    CINCINNATI: 2 #134548

    WAFER GRINDING, LAPPING & POLISHING Tool and cutter grinder Area of table: 36"x5.25" Swing over table: 10" Maximum center distance: 27" ...
顯示 每一頁
1

為何選擇CAE?