二手 EBARA UFP 200A #9100402 待售
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ID: 9100402
晶圓大小: 8"
優質的: 2003
Full automatic Cu plating system, 8"
Main body
Controller
Wafer holders
Wafers: W8-0333834-01 Semi standard 200mm, V notch 725um thick, semi-standard 200mm OF thickness 725um
Plating:
Post Cu
Method Electronics
Time: 90 min
Currency density: 5.4A/dm2
Liquid temp: 25°C
Plating sink: Dip
Anord including P
Thickness: 110~120 um
Re-wiring
Method: Electronics
Time: 14 min
Currency density: 2.0A/dm2
Liquid temp: 25°C
Plating sink: Dip
Anord including P
Thickness: 6.5 um
Transfer by robot
Operating mode: automatic, maintenance, return
Cu plating
Dry in/Dry out
Liquid insert
Liquid inside sink and tubing can be drawn
Semi standard cassette applicable
Semi standard load port applicable
(25) Fluoroware 200mm PA200-79MD
Semi standard cassette applicable robot
Can place wafers on rinse dryer
Can place wafers on notch aligner
Can handle wafers on notch aligner
Notch aligner can detect wafer notch
Rinse dryer can rinse wafers after plating
Can dry after plating
Holder transfer robot can remove wafer holder from wafer placing position
Wafer holder standard position from each sink
Stock sink: 2 x 19
Material: PVC
Voluum: 194 L
Accessories: Jig placing plate, liquid sensor, wafer holder sensor
Post water rinse: 2 x 3
Material: PVC
Volume: 72 L
Accessories: Jig placing plate, liquid sensor
Post process sink: 2 x 1
Material: HTPVC
Sink: Upper over flow
Volume: 37 L
Accessories: jig placing plate, liquid sensor, circulation pump, temp sensor, temp unit
Water rinse: 2 x 1
Material: PVC
Sink: quick damp
Volume: 17 L
Accessories: jig placing unit, liquid sensor
Cu plating: 2 x 26
Material: HTPVC
Sink: upper over flow
Volume: 280 L
Accessories: Jig placing unit, liquid sensor, liquid mixer, plating liquid circulation pump, temp sensor, temp unit
Blow: 2 x 1
Material: PVC
Volume: 17 L
Plating(spare) 2x2
Material HTPVC
sink upper over flow
Volume 72L
Accessories Jig placing plate, liquid sensor, liquid mixer, plating liquid circulation pump, temp sensor, temp unit
Waste sink 1
material PVC
Volume 205 L
Accessories liquid surface detector, waste liquid pump, temp sensor
Tubing
Can circulate plating liquid
can keep temperature at 25°C ±1°
Can exhaust waste liquid
Can add pure water
Currently warehoused
2003 vintage.
EBARA UFP 200A是為微電子基板的紫外線曝光和高精度蝕刻而設計的光刻設備。該系統采用大功率、穩定的燈，為必要的紫外線輻射源提供強大而高效的光源。其可調濾輪允許微調頻譜輸出，以達到最佳工作性能。該機器配備了高效的風冷冷凝器，以幫助在暴露過程中保持工作溫度。此外，該裝置還配備了防靜電機器，以減少汙染風險。UFP 200A光刻工具具有支持高性能處理的一系列功能。它具有用戶友好的觸摸屏界面和廣泛的設置，允許準確和精確地控制曝光過程。資產的數字輸出可用於驅動其他設備，如掃描儀，以方便蝕刻過程。此外，它還可以與多種基板一起使用，包括金屬、陶瓷和矽。該模型是為廣泛的蝕刻應用而設計的。根據溫度和壓力設置,EBARA UFP 200A每通道可蝕刻到8微米的深度。其基於激光的光電傳感器能夠精確控制曝光時間、錯誤檢測和自動校正過程。設備被編程為執行預熱、曝光和後硬化過程以及蝕刻過程。UFP 200A光致抗蝕劑系統是一種可靠、高效的裝置，可精確復制和蝕刻各種基板上的高分辨率結構。其用戶友好的界面和廣泛的設置提供了最大的功能，同時確保精確的結果。該機的堅固設計確保了多年的可靠性能，使得EBARA UFP 200A光刻和微電子加工的絕佳選擇。
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