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NIDEC TOSOK DBD-3550 SW Series #106015

NIDEC TOSOK

DBD-3550 SW Series

Die attach machine, 8" Bonding Method: Solder Chip Size: 1.0mm - 6.0mm Bonding Accuracy: XY = ±50 um
97
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NIDEC TOSOK DBD-3550 SW Series #100168

NIDEC TOSOK

DBD-3550 SW Series

Die attach machine, 8" Bonding Method: Solder Chip Size: 1.0mm - 6.0mm Bonding Accuracy: XY = ±50 um
87
NIDEC TOSOK DBD-3550 SW Series #194981

NIDEC TOSOK

DBD-3550 SW Series

Die attach machines with Mini HWay.
81