21
發現的結果
過濾器
全部清除
過濾器
21 結果
晶圓大小
-
(1)
-
(10)
優質的
-
(10)
-
(1)
-
(2)
-
(1)
-
(1)
-
(17)
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熱門產品
TDK
AFM 15
Flip chip bonders, 8"-12" Chip size range: 300um ~ 5000um Bonding process: Gold-to-gold interconnec
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熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
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熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
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熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
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熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
232
熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Power supply: Voltage: 200 V Frequency: 50 / 60 Hz 3 Phase Current: 3
232
熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Does not include computer Power supply: Voltage: 200 V Frequency: 50
251
熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
218
熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: 200 V, 3 Phase, 50/60 Hz, 3 Amp
193
熱門產品
TDK
AFM 15
Compact ultrasonic bonder, 8" Media handler type wafer Power supply: Voltage: 200 V Frequency: 50 /
250
